✦ 产品介绍：
FC-TSDO-0824型
安全数字输出模块
TSDO-0824型
最高额定值：30 VAC 或 42 VDC
最大2A
最大包围环境
工作温度 ： 70’C
SF36型
E166320
FC-TSDO-0824模块做8路FCTSDO0824 SM ESD HTAL模块，类型：8通道数字输出，电源：30/42VDC
IO 机箱 IO 机箱 （IOCHAS） 是一个机械外壳，其中包含水平 IOBus 背板、IO 模块外壳、IO 背板、电缆桥架，并在背面覆盖。包含 18 个 IO 插槽的 IO 机箱。它还包含一个 IO 背板、IO 扩展器和 IO 总线。IO 机箱可用于冗余和非冗余 IO。IO 背板 （IOB） 由多层 PCB 组成，其中一层是接地平面，以提高 EMC/RFI 抗扰度。IO 背板的正面包含用于安装 IO 模块和 IO 扩展器模块的 Eurocard 连接器。在背面，IO 背板为系统互连电缆 （SIC） 提供母连接器，这些电缆也连接到 FTA 模块。背面还提供编程连接器，允许根据现场设备的特定信号特性定制 IO 接口，例如数字线路监控输出阻抗、低、中、高或备用。IO背板中集成了IO模块的内部和外部配电，
FC-TSD0-0824
IO 总线 控制处理器通过 IO 总线控制 IO（位于 IO 机箱中）。IO 扩展器（位于 IO 机箱中）通过水平 IO 总线与各个 IO 模块通信。控制处理器通过IO总线与IO系统连接，IO总线是在机柜中垂直运行的扁平电缆。IO 总线由 IO 总线驱动程序功能控制，该功能是 QPP 模块的一部分。
每个 IO 机箱都包含一个 IO 扩展器 IO-0001 模块，该模块连接到 IO 总线。IO 扩展器模块驱动水平 IO 总线，水平 IO 总线通过扁平电缆将信号从 IO 总线中继到 IO 模块。水平 IO 总线背板位于每个 IO 机箱的顶部。水平 IO 总线和 IO 模块的扁平电缆覆盖有钢板盖，可提供最佳的 EMC/RFI 抗扰度。盖板包含一个纸条，用于固定用于信号识别的相关过程标签。
IO 模块 IO 模块构建在欧洲标准尺寸的仪器卡上。模块前面板的高度为3 HE（3U），宽度为4 TE（4 HP）。每个 IO 机箱总共可以放置 18 个 IO 模块。所有 IO 模块均配备标准 32 针 DIN 41612F 连接器。所有 IO 机箱都配有 IO 背板，其中包含匹配的 32 针连接器和密钥编码，以防止 IO 模块错误插入。
✦ 英语介绍:
Type FC-TDO-0824
Secure digital output module
Type TDO-0824
Maximum rating: 30 VAC or 42 VDC
Max. 2A
Maximum surrounding environment
Operating temperature: 70’C
SF36
E166320
The FC-TDO-0824 module works as an 8-channel FCTSDO0824 SM ESD HTAL module, type: 8-channel digital output, power supply: 30/42VDC
IO Chassis An IO chassis (IOCHAS) is a mechanical housing that contains a horizontal IOBus backplane, an IO module housing, an IO backplane, and a cable tray covered on the back. An I/O chassis with 18 I/O slots. It also contains an IO backplane, IO expander, and IO bus. The IO chassis can be used for redundant and non-redundant IO. The IO backplane (IOB) consists of multiple layers of PCBS, one of which is a ground plane to improve EMC/RFI immunity. The front of the IO backplane contains the Eurocard connector for mounting the IO module and the IO expander module. On the back, the IO backplane provides female connectors for the system interconnection cables (SIC), which also connect to the FTA module. Programmed connectors are also available on the back, allowing the IO interface to be customized to the specific signal characteristics of the field device, such as digital line monitoring of output impedance, low, medium, high, or standby. The I/O backplane integrates the internal and external power distribution of the I/O module.
FC-TSD0-0824
IO Bus control The processor controls IO through the IO bus (located in the IO chassis). The IO expander (located in the IO chassis) communicates with individual IO modules via a horizontal IO bus. The control processor is connected to the IO system via the IO bus, which is a flat cable that runs vertically in the cabinet. The IO bus is controlled by the IO bus driver function, which is part of the QPP module.
Each IO chassis contains an IO expander IO-0001 module, which is connected to the IO bus. The IO expander module drives the horizontal IO bus, which relays signals from the IO bus to the IO module via a flat cable. The horizontal IO bus backplane is located at the top of each IO chassis. Flat cables for the horizontal IO bus and IO modules are covered with a steel plate cover for optimal EMC/RFI immunity. The cover plate contains a strip that holds the associated process label for signal recognition.
IO module The IO module is built on an instrument card of European standard size. The front panel of the module has a height of 3 HE (3U) and a width of 4 TE (4 HP). Each I/O chassis can house a total of 18 I/O modules. All IO modules are equipped with standard 32-pin DIN 41612F connectors. All IO cases are equipped with an IO backplane, which contains a matching 32-pin connector and key encoding to prevent the IO module from being inserted incorrectly.
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✦常见问题解答
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这些产品库存量很大，今天就可以发货。
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